惠州市金乐盾新材料科技有限公司

The color is translucent, cured at room temperature, and the fully cured working temperature is -~℃. Jinshi Chemical produces one-component room temperature curing thermal conductive silica gel, which has the effect of cooling and bonding electronic devices. Can be cured into a higher hardness elastomer in a short time. Used in electronic component positioning, lighting industry, ceramic bonding, etc. This series of products has the advantages of high thermal conductivity, good insulation performance and ease of use. This product has good adhesion to metals including copper,
aluminum, stainless steel and other metals. After curing, it is dealcoholized and does not corrode metal and non-metal surfaces. After curing, it adheres closely to its contact surface to reduce thermal resistance
, thereby facilitating heat conduction between the heat source and the surrounding heat sink, motherboard, metal shell and outer casing.
Typical uses: widely used in thermal conductive pads, radiators, junctions between transistor intelligent control modules and radiators, transistors and thermistors, and filling adhesive between high-power electrical modules
and radiators. connection and heat dissipation. After using this glue, the traditional connection method of cards and screws can be eliminated. The result is more reliable filling and heat dissipation, simpler industry, and more economical cost.
For example: it can be widely used in integrated circuits of personal portable computers, mechanical processing agents, high power, memory modules, cache memories, sealed integrated chips, converters, B and other power modules, semiconductors, chargers, Packages for rectifiers, etc.